Wafer Level Package

См. также в других словарях:

• Embedded Wafer Level Ball Grid Array — Prinzipskizze eWLB Embedded Wafer Level Ball Grid Array (eWLB) ist eine Gehäusebauform für integrierte Schaltungen, bei der die Gehäuseanschlüsse auf einem aus Chips und Vergussmasse künstlich hergestellten Wafer erzeugt werden. Inhaltsverze …   Deutsch Wikipedia

• Chip scale package — A chip scale package (CSP) (sometimes, chip scale package with a hyphen) is a type of integrated circuit chip carrier. Originally, CSP was the acronym for chip size packaging. Since only a few packages are chip size, the meaning of the acronym… …   Wikipedia

• WLP — The initialism WLP may stand for several things, such as the following:*Wafer level package or Chip scale package, a type of integrated circuit (microchip) packaging *Weakest liberal precondition, a computer programming concept *Windows Logo… …   Wikipedia

• WLP — ist die Abkürzung für: Wärmeleitpaste Warehouse Location Problem Wafer Level Package, eine Bauform für integrierte Schaltkreise Diese Seite ist eine Begriffsklärung zur Unterscheidung mehrerer mit demselben Wort bezei …   Deutsch Wikipedia

• WLP — WellPoint Health Networks (Business » NYSE Symbols) ** Women s Learning Partnership (Community » Educational) ** Wafer Level Package (Academic & Science » Electronics) * Windows Logo Program (Computing » Drivers) * Washington Leadership Program… …   Abbreviations dictionary

• Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… …   Wikipedia

• Nasiri-Fabrication — Process The Nasiri Fabrication Process, patented by InvenSense, uses a wafer to wafer bonding process that allows for direct integration of the fabricated MEMS wafers to any off the shelf CMOS wafer at the wafer level. Although the wafer bonding… …   Wikipedia

• Microelectromechanical system oscillator — Microelectromechanical system (MEMS) oscillators are timing devices that generate highly stable reference frequencies. These reference frequencies are used to sequence electronic systems, manage data transfer, define radio frequencies, and… …   Wikipedia

• Nemotek Technologie — Type Private Industry Semiconductor Founded 2008 Headquarters Morocco …   Wikipedia

• Chip tridimensional (3D) — En electrónica, un circuito integrado tridimensional, o simplemente chip tridimensional (chip 3D), es un chip compuesto por dos o más capas de componentes electrónicos activos, integrados tanto vertical como horizontalmente, y formando un único… …   Wikipedia Español

• Bahgat G. Sammakia — is an Egyptian American mechanical engineer. He is currently a professor of mechanical engineering and director of both the Integrated Electronics Engineering Center and the Small Scale Systems Packaging Center at Binghamton University a part of… …   Wikipedia